Heat Sink for Power Electronics Applications
This 3D-printed liquid-cooled heat sink from aluminium nitride incorporates complex serpentine channels and integrated inlet/outlet stubs that enable efficient near-junction cooling with water, refrigerants, CO₂, or other coolants. By bringing the coolant directly to the heat source, thermal resistance is minimized, enabling higher power densities and improved reliability. These highly integrated internal cooling structures are enabled by our LCM technology and cannot be realized with conventional ceramic manufacturing methods.
This heat sink, manufactured from LithaFlux 211, combines high thermal conductivity (211 W/m.K), high electrical insulation, and CTE closely matched to silicon (4.3 ppm/K at 0–400°C). This allows direct integration with power semiconductor devices without additional isolation layers, supporting compact, high-performance thermal management in automotive, aerospace, and energy systems.







