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ELECTRONICS PACKAGING SYMPOSIUM | Binghamton, NY

Our 35th annual Electronics Packaging Symposium will take place Sept. 4-5, 2024, at the Binghamton University Innovative Technologies Complex. We will focus on various aspects of electronic packaging and how advance packaging is evolving toward a Chiplet future. We will update this webpage with the session titles and keynote speakers. We look forward to seeing you in September.

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