„Ceramic AM enables 500 mm dual-channel for high-speed PEALD and ALE in the same chamber“

As semiconductor manufacturers move towards larger substrates and faster atomic-scale processes, the components inside wafer production tools must scale up without compromising precision. Plasway-Technologies, Alumina Systems and Lithoz have developed a 500 mm dual-channel alumina gas distribution ring for Plasway-Technologies’ FAST Atomic Layering Process (FALP) platform. Produced using Lithoz’s ceramic Additive Manufacturing, the ring enables high-speed Plasma Enhanced Atomic Layer Deposition (PEALD) and Atomic Layer Etching (ALE) in the same chamber, while maintaining highly uniform gas distribution across large wafer substrates.

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