Overview
As semiconductor manufacturing processes move toward larger substrates, tighter tolerances, and harsher plasma environments, conventional ceramic components or even 3D-printed metal equivalents are increasingly becoming a limiting factor. Gas distribution rings for ALD and ALE tools must combine plasma resistance, dimensional stability, electrical integrity, and geometric complexity—at scales that push both traditional manufacturing and common metals to their limits.
This webinar in collaboration with Lithoz explores how ceramic additive manufacturing, advanced plasma process technology, and tool-level integration come together to address these challenges. Using a next-generation two-channel, 500 mm-class ceramic gas distribution ring as a real industrial case study, the session shows how additive manufacturing enables new component designs that directly support next-gen ALD and ALE performance.
The challenge:
- Increasing substrate sizes and complex plasma processes demand larger yet more precise ceramic components
- Conventional ceramic manufacturing struggles with internal channels, tight tolerances, and long iteration cycles
- Plasma-exposed parts formed from metals struggle with mechanical stability limitations
- Tool makers need faster development cycles without compromising reliability or yield
The solution:
- Lithography-based Ceramic Manufacturing (LCM®) enables complex, high-precision ceramic geometries that are impossible with conventional methods
- Atomic Layer Etching (ALE) and Plasma-Enhanced ALD (PEALD) are combined in a single low-temperature, high-throughput tool architecture
- Industrial-scale ceramic development, post-processing, and assembly deliver plasma-resistant components ready for real tool environment
What to expect during the webinar:
- Next-Gen 500 mm ceramic ALD ring for semiconductor manufacturing – presented by Plasway
First-hand insights into the design, details, manufacturing process, and performance parameters of a large-scale, 3D Printed two-channel ceramic gas distribution ring, povided by manufacturer Alumina Sytems. - LCM® ceramic 3D printing for harsh plasma environments
Lithoz introduces Lithography-based Ceramic Manufacturing (LCM®) and explains why it exceeds metal and conventional ceramics, therefore suited for producing high-precision, plasma-resistant ceramic components for semiconductor equipment. - Atomic Layer Etching (ALE) and PEALD in a single integrated tool
Plasway presents the FALP tool, combining ALE and PEALD in one system for low-temperature processing, high throughput, and excellent electrical film quality. - Real measurement and process results
Measurement and testing data including ALE results for Si, Ga, GaN, SiO₂, Al₂O₃, and TiO₂, as well as first PEALD results on large 17” optical substrates and initial electrical film characterization. - From ceramic design to final assembly
Alumina Systems provides a deep dive into the full manufacturing chain of the ceramic gas distribution ring, covering 3D manufacturing, development iterations, thermal treatment, and final assembly. - How additive manufacturing, plasma process technology, and tool integration come together
A holistic view on how advanced ceramic AM, next-generation plasma processes, and system integration enable new possibilities for semiconductor, high-power, and optical applications.
