
Silver and Ceramic
The combination of ceramic and pure silver in a single part via multi-material 3D printing is pushing the limits of what LTCC (Low-Temperature Co-fired Ceramic) modules can achieve. Additive manufacturing enables highly customized geometries and the precise placement of conductive paths directly into dielectric ceramic structures—capabilities that are unachievable with traditional methods.
LTCC technology is essential in modern electronics, offering compact, stable, and reliable solutions. It’s widely used in telecommunications, automotive, aerospace, and consumer electronics to embed passive components like capacitors and inductors in multilayer ceramic modules. LTCC is particularly crucial for RF systems, including 5G, satellite communication, and radar.
In automotive and aerospace, 3D-printed LTCC-silver components support high-reliability systems like radar, GPS, and V2X communication. The fusion of LTCC with 3D-printed silver opens new possibilities for lighter, smaller, and more efficient high-frequency electronics.